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Built by Ajinkya Kale

© 2026 ChipFlow Tech. All rights reserved.

The Product Universe

Everything around semiconductor packaging.

One semiconductor-focused supply partner — from the leadframes we manufacture in India to the qualified global materials and consumables that keep assembly lines running.

MakeManufactured in India
SourceQualified global supply
LocalizeOn the roadmap

Flagship

Make

Leadframes, built to semiconductor-grade discipline.

The structural and electrical foundation of the package — stamped or etched, precision-plated, inspected and fully traceable.

IC Leadframes

  • 01QFN / DFN
  • 02SOIC / SOP
  • 03TSSOP / SSOP
  • 04QFP / LQFP / TQFP
  • 05DIP

Discrete & Power

  • 01TO-series
  • 02Power discrete
  • 03MOSFET
  • 04Diode & rectifier
  • 05Transistor

Application-Specific

  • 01Automotive
  • 02Power management IC
  • 03Sensor & MEMS
  • 04LED / optoelectronic
  • 05Custom package

Custom leadframe development

Start a development →

Your package, your specification, our manufacturing platform — from lead count and strip dimensions to alloy, plating and wire-bond requirements.

  1. 01

    Requirement

  2. 02

    Technical review

  3. 03

    Design / DFM

  4. 04

    Tooling / etching

  5. 05

    Prototype samples

  6. 06

    Qualification

  7. 07

    Pilot

  8. 08

    Mass production

Packaging Materials

Source

Qualified materials, consolidated procurement.

Proven global manufacturers across the materials consumed continuously in high-volume assembly — without waiting for every product to be localized.

Bonding Wire

  • 01Gold wire
  • 02Copper wire
  • 03Pd-coated copper
  • 04Aluminium wire

Molding Materials

  • 01Epoxy molding compounds
  • 02Encapsulants
  • 03Underfills

Die Attach

  • 01Die-attach adhesives
  • 02Conductive epoxy
  • 03Solder-based
  • 04Sintering materials

Packaging Tapes

  • 01Dicing tape
  • 02Back-grinding tape
  • 03UV tape
  • 04High-temp process tape

Solder & Interconnect

  • 01Solder paste
  • 02Solder wire
  • 03Solder preforms
  • 04Fluxes
  • 05Specialty interconnect

Handling & Production Consumables

Source

Everything the line consumes, day after day.

·JEDEC trays
·IC trays
·Wafer frames
·Wafer rings
·Carrier tapes
·Cover tapes
·Reels
·Waffle packs
·Gel packs
·ESD packaging
·Moisture barrier bags
·Cleanroom consumables
·Specialty packaging

Future Opportunities

Localize

Localizing what customers need next.

·Advanced packaging consumables
·Thermal interface materials
·Specialty plating materials
·Package substrates
·Custom precision components

Send us your imported BOM.

Together we can identify what can be sourced, qualified, localized and ultimately manufactured in India.