Critical Materials · Reliable Supply
Built for semiconductor packaging.
Encapsulation
Every chip must be packaged, protected and tested.
Interconnect
Behind every package, a supply chain.
Our Flagship
It starts with the leadframe.
From chip to package, every component matters.
Make in India. For the World.
Molding compounds, encapsulants and underfills — the materials that turn a fragile die into a device the world can build with.
Bonding wire, die-attach materials and precision interconnect — consumed continuously across high-volume assembly.
The structural and electrical foundation of the package — and where ChipFlow Tech is building India's manufacturing capability.
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Our Model
Manufacture. Source. Localize.
Make
Manufacture what matters
Develop manufacturing capability in India for strategically important, high-consumption packaging components. Leadframes are our starting point.
Source
Source what customers need
Partner with qualified global manufacturers to offer a broader OSAT procurement solution — without waiting for every product to be localized.
Localize
Localize what makes sense
Identify imported consumables with real demand and build Indian capability through in-house manufacturing, partnerships and joint ventures.
Trade creates market access. Market access creates knowledge. Knowledge creates localization opportunities.
Flagship — Leadframes
Small component. Critical role. Massive repetition.
Producing millions of leadframes with extremely consistent dimensions, plating and material properties is the manufacturing discipline where ChipFlow Tech intends to compete.
IC Leadframes
05Discrete & Power
05Application-Specific
05Manufacturing capabilities we aim to build
Made in India. Qualified by the World.
India's semiconductor opportunity is larger than import substitution — the real opportunity is to build companies capable of entering the global supply chain.
Quality is the product
Semiconductor manufacturing leaves little room for variability.
Quality cannot be an inspection at the end of production. It must be built into the process — aligned with the expectations of global semiconductor and automotive supply chains.
Material Control
Defined specifications and supplier traceability.
Process Control
Controlled parameters and repeatable processes.
Dimensional Control
Precision measurement against customer drawings.
Plating Control
Thickness, adhesion and package-specific requirements.
Lot Traceability
Material-to-production-to-shipment traceability.
Continuous Improvement
SPC, root-cause analysis and systematic gains.
The Roadmap
From trusted supplier to global export platform.
A phased path — each stage earns the next, growing with customer qualifications rather than ahead of them.
Supply
Build relationships with OSATs, ATMPs and IDMs while supplying qualified consumables.
Localize
Establish Indian manufacturing for high-value products — beginning with leadframes.
Scale
Expand capacity, processes and product families as customer qualifications grow.
Export
Supply packaging facilities across Asia, Europe, the Americas and beyond.
Made in India. Qualified by the world.
Partner with ChipFlow Tech
Let's build the semiconductor supply chain together.
Whether you are an OSAT looking for a reliable supplier, a global materials company seeking an Indian partner, or a semiconductor company exploring localization — we would like to hear from you.